IC wafer processing service
Wafer processing contract service
- Back grinding processing - Laser grooving / dicing processing with blades - Rib cutting of TAIKO*1 wafers - We can also handle bare die shipping and package assembly. - You can also choose the shipping method. (Tray, dicing tape, embossed tape (reel) packaging, etc.) If you have any concerns, please feel free to contact us. *1 TAIKO is a registered trademark of Disco Corporation. TAIKO Process The "TAIKO Process" is a technology that differs from conventional back grinding. When grinding the wafer, it leaves the edge portion of the outer circumference (about 3 mm) intact and only grinds the inner circumference to reduce thickness. The introduction of this technology reduces the transport risk of thin wafers and minimizes warping. (Refer to https://www.disco.co.jp/jp/solution/library/grinder/taiko_process.html)
- Company：エスタカヤ電子工業
- Price：Other
